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| HCC4011B/12B/23B HCF4011B/12B/23B NAND GATES QUAD 2 INPUT HCC/HCF 4011B DUAL 4 INPUT HCC/HCF 4012B TRIPLE 3 INPUT HCC/HCF 4023B .PROPAGATI .BUFFEREDI .QUI .I .100%TESTEDFORQUI .5V,10VAND15VPARAMETRI .MEETSALLREQUI ON DELAY TIME = 60ns (typ.) AT CL = 50pF, VDD = 10V NPUTS AND OUTPUTS ESCENT CURRENT SPECIFIED TO 20V FOR HCC DEVICE NPUT CURRENT OF 100nA AT 18V AND 25C FOR HCC DEVICE ESCENT CURRENT C RATINGS REMENTS OF JEDEC TENTATIVE STANDARD No. 13A, "STANDARD SPECIFICATIONS FOR DESCRIPTION OF "B" SERIES CMOS DEVICES" EY (Plastic Package) F (Ceramic Frit Seal Package) M1 (Micro Package) C1 (Plastic Chip Carrier) ORDER CODES : HCC40XXBF HCF40XXBM1 HCF40XXBEY HCF40XXBC1 DESCRIPTION The HCC4011B, HCC4012B and HCC4023B (extended temperature range) and HCF4011B, HCF4012B and HCF4023B (intermediate temperature range) are monolithic, integrated circuit, available in 14-lead dual in-line plastic or ceramic package and plastic micropackage. PIN CONNECTIONS 4011B The HCC/HCF4011B, HCC/HCF4012B and HCC/HCF4023B NAND gates provide the system designer with direct implementation of the NAND function and supplement the existing family of COS/MOS gates. All inputs and outputs are buffered. 4012B 4023B June 1989 1/12 HCC/HFC4011B/12B/23B ABSOLUTE MAXIMUM RATINGS Symbol V DD * Vi II Pto t Parameter Supply Voltage : HC C Types H CF Types Input Voltage DC Input Current (any one input) Total Power Dissipation (per package) Dissipation per Output Transistor for T o p = Full Package-temperature Range Operating Temperature : HCC Types H CF Types Storage Temperature Value - 0.5 to + 20 - 0.5 to + 18 - 0.5 to V DD + 0.5 10 200 100 - 55 to + 125 - 40 to + 85 - 65 to + 150 Unit V V V mA mW mW C C C T op T stg Stresses above those listed under "Absolute Maximum Ratings" may cause permane damage to the device. This is a stress rating only and nt functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to VSS pin voltage. RECOMMENDED OPERATING CONDITIONS Symbol V DD VI T op Parameter Supply Voltage : HC C Types H C F Types Input Voltage Operating Temperature : HC C Types H C F Types Value 3 to 18 3 to 15 0 to V DD - 55 to + 125 - 40 to + 85 Unit V V V C C 2/12 HCC/HCF4011B/12B/23B SCHEMATIC AND LOGIC DIAGRAMS 4011B 4012B 4023B 3/12 HCC/HFC4011B/12B/23B STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Test Conditions Symbol Parameter VI (V) 0/5 HCC 0/10 Types 0/15 0/20 0/ 5 HCF 0/10 Types 0/15 V OH Output High Voltage 0/5 0/10 0/15 V OL Output Low Voltage 5/0 10/0 15/0 V IH Input High Voltage 0.5/4.5 1/9 4.5/0.5 9/1 0/5 0/5 HCC Types 0/10 0/15 0/5 0/5 HCF Types 0/10 0/15 I OL Output Sink Current 0/5 HCC 0/10 Types 0/15 0/5 HCF 0/10 Types 0/15 I IH , I IL Input Leakage Current HCC 0/18 Types HCF 0/15 Types Any Input 2.5 4.6 9.5 13.5 2.5 4.6 9.5 13.5 0.4 0.5 1.5 0.4 0.5 1.5 <1 <1 <1 <1 <1 <1 <1 <1 <1 <1 VO (V) Value Unit |I O | V D D T L o w* 25 C T Hi g h * (A) (V) Min. Max. Min. Typ. Max. Min. Max. 5 10 15 20 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 5 10 15 5 5 10 15 5 10 15 5 10 15 18 Any Input 15 -2 - 0.64 - 1.6 - 4.2 - 1.53 - 0.52 - 1.3 - 3.6 0.64 1.6 4.2 0.52 1.3 3.6 0.1 0.3 3.5 7 11 1.5 3 4 - 1.6 - 3.2 - 0.51 - 1 - 1.3 - 2.6 - 3.4 - 6.8 - 1.36 - 3.2 - 0.44 - 1 - 1.1 - 2.6 - 3.0 - 6.8 0.51 1.3 3.4 0.44 1.1 3.0 1 2.6 6.8 1 2.6 6.8 10 - 5 0.1 10 - 5 0.3 5 7.5 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 - 1.15 - 0.36 - 0.9 - 2.4 - 1.1 - 0.36 - 0.9 - 2.4 0.36 0.9 2.4 0.36 0.9 2.4 1 1 A mA mA 0.25 0.5 1 5 1 2 4 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 V V 0.01 0.01 0.01 0.02 0.01 0.01 0.01 0.25 0.5 1 5 1 2 4 4.95 9.95 14.95 0.05 0.05 0.05 V V 7.5 15 30 150 7.5 15 30 A IL Quiescent Current 1.5/13.5 < 1 V IL Input Low Voltage 13.5/1.5 < 1 I OH Output Drive Current CI Input Capacitance pF * TLOW = - 55Cfor HCC device : - 40C for HCF device. * THIGH = + 125C for HCC device : + 85C for HCF device. The Noise Margin for both "1" and "0" level is : 1V min. with VDD = 5V, 2V min. with VDD = 10V, 2.5V with VDD = 15V. 4/12 HCC/HCF4011B/12B/23B DYNAMIC ELECTRICAL CHARACTERISTICS (T amb = 25C, C L = 50pF, R L = 200k, typical temperature coefficient for all VD D values is 0.3%/C, all input rise and fall times = 20ns) Symbol Parameter Test Conditions V D D (V) Min. 5 10 15 t THL , t T L H Transition Time 5 10 15 Value Typ. 125 60 45 100 50 40 Max. 250 120 90 200 100 80 ns ns Unit t PL H, t P HL Propagation Delay Time TEST CIRCUITS Quiescent Device Current. Noise Immunity. Input Leakage Current. 5/12 HCC/HFC4011B/12B/23B Minimum Output High (source) Current Characteristics. Minimum Output Low (sink) Current Characteristics. Typical Output High (source) Current Characteristics. Typical Output Low (sink) Current Characteristics. Typical Propagation Delay Time per Gate as a Function of Load Capacitance. Typical Transition Time vs. Load Capacitance. 6/12 HCC/HCF4011B/12B/23B Typical Voltage Transfer Characteristics. Typical Power Dissipation/gate vs Frequency. 7/12 HCC/HFC4011B/12B/23B Plastic DIP14 MECHANICAL DATA mm MIN. a1 B b b1 D E e e3 F I L Z 1.27 3.3 2.54 0.050 8.5 2.54 15.24 7.1 5.1 0.130 0.100 0.51 1.39 0.5 0.25 20 0.335 0.100 0.600 0.280 0.201 1.65 TYP. MAX. MIN. 0.020 0.055 0.020 0.010 0.787 0.065 inch TYP. MAX. DIM. P001A 8/12 HCC/HCF4011B/12B/23B Ceramic DIP14/1 MECHANICAL DATA mm MIN. A B D E e3 F G H L M N P Q 7.8 2.29 0.4 1.17 0.22 1.52 0.38 15.24 2.79 0.55 1.52 0.31 2.54 10.3 8.05 5.08 0.307 0.090 0.016 0.046 0.009 0.060 3.3 0.015 0.600 0.110 0.022 0.060 0.012 0.100 0.406 0.317 0.200 TYP. MAX. 20 7.0 0.130 MIN. inch TYP. MAX. 0.787 0.276 DIM. P053C 9/12 HCC/HFC4011B/12B/23B SO14 MECHANICAL DATA DIM. MIN. A a1 a2 b b1 C c1 D E e e3 F G L M S 3.8 4.6 0.5 8.55 5.8 1.27 7.62 4.0 5.3 1.27 0.68 8 (max.) 0.149 0.181 0.019 8.75 6.2 0.35 0.19 0.5 45 (typ.) 0.336 0.228 0.050 0.300 0.157 0.208 0.050 0.026 0.344 0.244 0.1 mm TYP. MAX. 1.75 0.2 1.65 0.46 0.25 0.013 0.007 0.019 0.003 MIN. inch TYP. MAX. 0.068 0.007 0.064 0.018 0.010 P013G 10/12 HCC/HCF4011B/12B/23B PLCC20 MECHANICAL DATA mm MIN. A B D d1 d2 E e e3 F G M M1 1.27 1.14 7.37 1.27 5.08 0.38 0.101 0.050 0.045 9.78 8.89 4.2 2.54 0.56 8.38 0.290 0.050 0.200 0.015 0.004 TYP. MAX. 10.03 9.04 4.57 MIN. 0.385 0.350 0.165 0.100 0.022 0.330 inch TYP. MAX. 0.395 0.356 0.180 DIM. P027A 11/12 HCC/HFC4011B/12B/23B Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 12/12 |
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